Flexible Electronics News

Security Components Developed for Future Smart Cards and ID Cards

SECUDIS research project brought to a successful close after three years

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By: DAVID SAVASTANO

Editor, Ink World Magazine

After three years of cooperation, Bundesdruckerei GmbH, Bayer MaterialScience, the Fraunhofer institutes IZM, IAP and EMFT, as well as NXP Semiconductors have successfully brought to a conclusion the SECUDIS joint research project. As part of this project, security components for ID documents have been researched and developed which will be used in future product developments. At the end of the SECUDIS project, the partners expressed their satisfaction with the results of the project. The abb...

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